Wafer test, final test
Wafer test. Using a tester to determine the good and defective chips one by one.
Wafer Testing and Final Testing by Sawara Techno Co., Ltd. 【Features】 ○ Wafer Testing - Probes are contacted with the electrode pads of chips created on the wafer, and a tester connected to these probes determines the quality of each chip as good or defective. - Compatible with LCD drivers, and after-marking is also possible. - Integrated processing with dicing (headquarters factory) is available. - Supports 5-inch, 6-inch, and 8-inch wafers. ○ Final Testing - Probes are contacted with the lead parts of IC packages, and a tester connected to these probes classifies the products as good or defective. - The handler supports DIP, SOP, and SSOP, and the tester is equipped with a logic tester. After electrical testing, experienced inspectors conduct package appearance inspections. - Consistent production is possible up to embossed taping packaging using a taping machine with image processing equipment. - Over 15 years of experience in final testing and embossed taping packaging, operating 24 hours a day. ● For more details, please contact us.
